Dual channel trench ldmos transistors and transistors integrated therewith

ABSTRACT

A dual channel trench LDMOS transistor includes a semiconductor layer of a first conductivity type formed on a substrate; a first trench formed in the semiconductor layer where a trench gate is formed in an upper portion of the first trench; a body region of the second conductivity type formed in the semiconductor layer adjacent the first trench; a source region of the first conductivity type formed in the body region and adjacent the first trench; a planar gate overlying the body region; a drain drift region of the first conductivity type formed in the semiconductor layer and in electrical contact with a drain electrode. The planar gate forms a lateral channel in the body region, and the trench gate in the first trench forms a vertical channel in the body region of the LDMOS transistor.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of application Ser. No. 13/440,929,filed Apr. 5, 2012, entitled “Vertical Trench LDMOS Transistor,” of thesame inventor hereof, which is a divisional of application Ser. No.12/629,844, filed Dec. 2, 2009, entitled “Dual Channel Trench LDMOSTransistors and BCD Process with Deep Trench Isolation,” of the sameinventor hereof, now U.S. Pat. No. 8,174,070, which patent and patentapplication are incorporated herein by reference in their entireties.

FIELD OF THE INVENTION

The invention relates to high voltage semiconductor devices and themanufacturing process thereof and, in particular, to a LDMOS transistorhaving a planar channel and a trench channel and to trench isolation ina BCD (Bipolar CMOS and DMOS) fabrication process.

DESCRIPTION OF THE RELATED ART

Lateral double-diffused metal-oxide-semiconductor (LDMOS) transistorsare commonly used in high-voltage applications (20 to 500 volts) becauseof their high breakdown voltage characteristics and compatibility withCMOS technology for low voltage devices. In general, an LDMOS transistorincludes a polysilicon gate, an N+ source region formed in a P-type bodyregion, and an N+ drain region. The N+ drain region is separated fromthe channel formed in the body region under the polysilicon gate by an Ndrift region. It is well known that by increasing the length of the Ndrift region, the breakdown voltage of the LDMOS transistor can beaccordingly increased.

Bipolar-CMOS-DMOS (BCD) process technologies refer to semiconductorfabrication processes that incorporate bipolar, complementary MOS (CMOS)and DMOS devices into a single fabrication process flow. In general,bipolar devices are used for analog circuitry, CMOS devices are used fordigital circuitry and DMOS devices are used for handling high voltageand current demands for managing on-chip or system power. Thus, BCDprocesses are often used for manufacturing high voltage mixed signalintegrated circuits or analog system-on-chip applications, withparticular applications in wireless handheld electronics and consumerelectronics.

SUMMARY OF THE INVENTION

According to one embodiment of the present invention, a semiconductordevice includes a dual channel trench LDMOS transistor where the dualchannel trench LDMOS transistor includes a semiconductor layer of afirst conductivity type formed on a substrate; a first trench formed inthe semiconductor layer, the first trench being filled with a trenchdielectric, a trench gate being formed in the first trench and insulatedfrom the sidewall of the first trench by a first gate dielectric layer;a body region of a second conductivity type formed in the semiconductorlayer adjacent the first trench; a source region of the firstconductivity type formed in the body region and adjacent the firsttrench; a planar gate insulated from the semiconductor layer by a secondgate dielectric layer and overlying the body region, the source regionbeing formed aligned to a first edge of the planar gate; and a draindrift region of the first conductivity type formed in the semiconductorlayer and in electrical contact with a drain electrode. The planar gateforms a lateral channel of the LDMOS transistor in the body regionbetween the source region and the drain drift region, and the trenchgate in the first trench forms a vertical channel of the LDMOStransistor in the body region along the sidewall of the first trenchbetween the source region and the semiconductor layer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a dual channel trench LDMOStransistor according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a dual channel trench LDMOStransistor according to a second embodiment of the present invention.

FIG. 3 is a top view of a dual channel trench LDMOS transistor accordingto a third embodiment of the present invention.

FIG. 4 is a top view of a dual channel trench LDMOS transistor accordingto a fourth embodiment of the present invention.

FIG. 5 is a top view of a dual channel trench LDMOS transistor accordingto a fifth embodiment of the present invention.

FIG. 6 is a top view of a dual channel trench LDMOS transistor accordingto a sixth embodiment of the present invention.

FIG. 7 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to one embodimentof the present invention.

FIG. 8 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to anotherembodiment of the present invention.

FIG. 9 is a cross-sectional view of a dual channel trench LDMOStransistor incorporating a drain super-junction structure according toone embodiment of the present invention.

FIG. 10 illustrates the electrical field distribution of the LDMOStransistor of FIG. 9 with or without the super-junction structure.

FIG. 11 is a cross-sectional view of a dual channel trench LDMOStransistor incorporating a drain super-junction structure according toan alternate embodiment of the present invention.

FIG. 12 is a cross-sectional view of a dual channel trench LDMOStransistor incorporating a bottom drain according to another embodimentof the present invention.

FIG. 13 is a cross-sectional view of a vertical trench MOS transistorwhich may be integrated with a dual channel device according to oneembodiment of the present invention.

FIG. 14 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to an alternateembodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

In accordance with the principles of the present invention, a BCD(Bipolar-CMOS-DMOS) fabrication process incorporates deep oxide-filledtrenches with single or stacked gate for use as deep trench isolationand for active gate. In some embodiments, a dual channel trench LDMOS isformed using the trench gate as a vertical channel and a planar gate asa lateral channel. In other embodiments, the bottom gate electrode iselectrically connected to the source potential to provide increasedshielding and improve the breakdown sustainability of the devices thusformed. In other embodiments, super-junction structures are formed inthe drain drift region of the LDMOS transistor to reduce the drainresistance and increase the breakdown voltage in the drain drift region.

Through the use of deep trench isolation with trench gate structures, alow cost and high performance BCD process is realized. The BCD processin accordance with the present invention is able to eliminate severalmasks, thereby reducing the fabrication processing steps and complexity.The BCD process with deep trench isolation also realizes compactisolation, which along with the heavily doped N-type buried layer (NBL),reduces the parasitic PNP gain and thereby improves immunity tolatch-up. The lateral NPN gain is reduced by deep trench isolation andby use of P channel stop implant at the bottom of the deep trenches.

The dual channel LDMOS transistor realizes higher channel density as twochannels are formed in the same area of a conventional LDMOS transistor.Accordingly, the channel resistance (Rds*A) of the LDMOS transistor isreduced in half. By using a vertical and a lateral channel in a LDMOStransistor, the on-resistance of the LDMOS transistor is reduced and theperformance of the LDMOS transistor is improved.

When the LDMOS transistor of the present invention incorporatessuper-junction structure at the drain region, further reduction inchannel resistance (Rds*A) of the transistor is realized. In oneembodiment, greater than 70% reduction in the total LDMOS resistance(Rds*A) is achieved.

(1) Dual Channel Trench LDMOS

According to one aspect of the present invention, a dual channel trenchLDMOS includes a planar gate forming a lateral channel and an activetrench gate forming a vertical channel. The trench gate is formed in adeep oxide filled trench where the deep oxide filled trench can also beused for high voltage isolation of the LDMOS transistor or other devicesformed in the same fabrication processes. The trench gate of the LDMOStransistor forms a shielded gate trench (SGT) structure to realize lowergate to drain capacitance per unit area and to improve breakdowncharacteristics.

In some embodiments of the present invention, the dual channel trenchLDMOS transistor is formed with a single shallow trench gate to act asthe active gate for the LDMOS transistor. In other embodiment, a stackedgate structure is formed in the trench where the bottom gate forms anelectrode connected to the source voltage used for super-junction effectin the drain region and to provide shielding.

(a) Single Active Gate

FIG. 1 is a cross-sectional view of a dual channel trench LDMOStransistor according to a first embodiment of the present invention.Referring to FIG. 1, a trench LDMOS transistor 10 is formed on a P-typesubstrate 12 with an N-type buried layer (NBL) 14 formed thereon. AnN-type epitaxial (N-Epi) layer 16 is formed on the buried layer 14 inwhich the active regions of the transistor is formed. N-type buriedlayer 14 is optional and is generally included to improve deviceisolation and latchup immunity. N-type buried layer 14 may be omitted inother embodiments. The NBL 14 may be formed by a standard buried layerimplantation process, or alternatively, may be formed using a stepepitaxial process. That is, a heavily doped N-type epitaxial layer isfirst grown on top of the P substrate 12 to serve as NBL 14, and thenthe N-type epitaxial layer 16, less heavily doped than NBL 14, is grownon top of the epitaxially formed NBL 14. In the present description, theN-Epi layer 16, the N-buried layer 14 and the substrate 12 are sometimesreferred to as the “semiconductor layers”.

Deep trenches 30 are formed in the N-Epi 16 and N-buried layer 14 intothe substrate 12. Trenches 30 are filled with a dielectric material. Inthe present embodiment, trenches 30 are filled with silicon oxide andthus are referred to as “oxide-filled trenches”. In other embodiments,other dielectric materials may be used to fill trenches 30. Furthermore,a trench gate 28 is formed in the upper portions of trenches 30. In thepresent embodiment, trench gate 28 is a polysilicon gate. In otherembodiments, other conductive gate materials may be used. Trench gate 28is insulated from the sidewall of the trenches by a gate dielectriclayer. The gate dielectric layer is typically formed separately from thetrench oxide to obtain a better quality oxide. More specifically, thegate dielectric layer on the sidewall of the trenches is typicallyformed using thermal oxidation. As thus configured, oxide-filledtrenches 30 form deep trench isolation structure for trench LDMOStransistor 10 and the trench gate 28 forms an active gate for trenchLDMOS transistor 10, as will be described in more detail below.

Trench LDMOS transistor 10 includes a planar gate 26, an N+ sourceregion 23 formed in a P-type body region 22, and an N+ drain region 24.In the present embodiment, planar gate 26 is a polysilicon (poly) gateand is insulated from the semiconductor layers by a thin gate oxidelayer 25. In other embodiments, planar gate 26 can be formed using otherconductive gate materials. The source region 23 is typicallyself-aligned to an edge of the planar gate 26. In the presentembodiment, the P-type body region 22 is formed using a low voltageP-well (LVPW) in the fabrication process. In other embodiments, theP-type body region 22 may be formed through a P-type implantself-aligned to the edge of planar gate poly 26. Drain region 24 isformed in an N-type region and serves as the drain contact region of theLDMOS transistor. In the present embodiment, a drain drift region isformed using a low-voltage N-well (LVNW) 20 formed in a high-voltageN-well (HVNW) 18, both formed in the N-Epi layer 16. In general, thelow-voltage N-well 20 has a higher doping concentration than thehigh-voltage N-well 18. The doping scheme used here is sometimesreferred to as a graded doped drain, in which the doping increases fromthe body region 22 towards the N+ drain region 24. In other embodiments,the drain drift region can be formed using one or more N-type regions.

In the dual channel trench LDMOS transistor 10, a P+ region is includedfor making electrical contact to body region 22. In the presentembodiment, the P+ body contact region is formed in the z-direction ofthe device, that is, perpendicular to the cross-section shown in FIG. 1.Therefore, the P+ body contact region is not shown in FIG. 1. The P+body contact region can be formed as alternating N+ and P+ regions orthe P+ regions can be formed in islands or stripes, as shown in FIGS.3-6 and described in more detail below. The exact structure of the P+body contact region is not critical to the practice of the presentinvention and it is only necessary that the P+ body contact region bespaced apart from trench 30 including the active trench gate.

In the present embodiment, the end portion of planar gate 26 extendsover a field oxide layer 32. Extending planar gate 26 over a field oxidelayer 32 has the effect of relaxing the electric field at the edge ofthe planar gate 26. In other embodiments, the planar gate can extendover a step oxide layer or other oxide structure. A step oxide layerrefers to an oxide layer formed on top of the semiconductor layers, asopposed to a field oxide layer which is formed partially in thesemiconductor layers as the field oxide layer consumes the silicon inthe topmost semiconductor layer when formed. In yet other embodiments,the planar gate can be formed entirely on the gate oxide layer formed onthe semiconductor layers without any end portion extending over anyother oxide structure.

Trench LDMOS transistor 10 further includes an insulating dielectriclayer 35 formed over the semiconductor layers. A contact opening is madein the insulating dielectric layer 35 to the N+ source 23 and a metalcontact 34 is formed as an electrical contact to the N+ source (and tothe P+ body where applicable). Another contact opening is made in theinsulating dielectric layer 35 to the N+ drain 24 and a metal contact 36is formed as an electrical contact to the N+ drain.

As thus constructed, trench LDMOS transistor 10 includes two activegates and two channels. Planar gate 26 forms a lateral channel in theP-body region 22 near the surface of the semiconductor layers (i.e.N-Epi 16). Electrons flow from the N+ source region 23, through thelateral channel in the P-body region 22 in the lateral direction intothe drain drift region formed by N-Epi 16, N-well 18 and N-well 20 untilN+ drain region 24 is reached. Meanwhile, trench gate 28 forms avertical channel in the P-body region 22 along the side of the trench30. Electrons flow from the N+ source region 23, through the verticalchannel in the P-body region 22 in the vertical direction into the N-Epilayer 16 and into the N-buried layer 14. Electrons from the verticalchannel flow laterally across the N-buried layer 14 and then up throughthe N-wells 18, 20 to reach the N+ drain region 24.

By forming a vertical channel in conjunction with a lateral channel inLDMOS transistor 10, an immediate reduction in the channel resistanceRds*A of up to 50% is obtained, assuming both planar gate and verticalgate have the same width. The two channels allow the channel width W ofthe transistor to be increased while reducing the channel resistance inhalf.

In one embodiment, the planar gate and the trench gate are electricallyconnected so both lateral and vertical channels switch on and off at thesame time. In another embodiment, the planar gate and the trench gateare separately controlled so that each gate turns on and offindependently of each other. This configuration is referred to as “Wswitching” as the width of the transistor is selectively switched toincrease or decrease the total width of the active gate. Morespecifically, under high current situations, both the planar gate andthe trench gate are switched on and off in unison. However, when thecurrent demand decreases, only one of the gates is activated for use.Either the planar gate or the trench gate can be selected for use in lowcurrent conditions. In this manner, in low current conditions, the gatecapacitance is reduced because only a portion of the total gate, e.g.only the planar gate, is activated.

In FIG. 1, trench gate 28 b formed in a trench 30 b on the drain side ofLDMOS transistor 10 can be used as an active gate for an adjacent trenchLDMOS transistor. In the case when oxide-filled trench 130 on the drainside is used only for isolation, then trench gate 28 b is grounded orconnected to an electrical potential to deactivate the gate.

Furthermore, in FIG. 1, a P-type channel stop region 38 is formed at thebottom of trenches 30. P-type channel stop region 38 has the function ofreducing the lateral NPN gain, thereby improving latchup immunity.Channel stop region 38 is optional and may be omitted in otherembodiments of the present invention.

(b) Stacked Gate

FIG. 2 is a cross-sectional view of a dual channel trench LDMOStransistor according to a second embodiment of the present invention.Referring to FIG. 2, a trench LDMOS transistor 100 is constructed insubstantially the same manner as trench LDMOS transistor 10 of FIG. 1except with the use of the stacked gate structure in the trenches. Likeelements in both figures will not be further described. In the presentembodiment, trench LDMOS transistor 100 includes deep oxide-filledtrenches 130 with a stacked gate structure formed therein. That is, eachoxide-filled trench 130 includes a trench gate 128 formed at an upperportion of the trench and a bottom gate electrode 140 formed at a bottomportion of the trench. Trench gate 128 and bottom gate electrode 140 areinsulated from each other. In one embodiment, both the trench gate andthe bottom gate electrode are formed of polysilicon. In otherembodiments, other conductive gate materials may be used.

More specifically, trench gate 128 is connected to a gate potential whentrench gate 128 is used as an active gate for trench LDMOS transistor100. The trench gate can also be grounded or otherwise deactivated whenthe trench gate is not used as an active gate (such as trench gate 128b). Bottom gate electrode 140 is electrically connected to the sourcepotential to realize super-junction effect in the drain region. Bottomgate electrode 140 also has the function of increasing shielding of thetrench gate 128 from the drain potential at the N-buried layer 14.

In the present embodiment, the bottom gate electrode 140 is thinner thanthe trench gate 128 and the trench oxide is thicker adjacent the bottomgate electrode 140 as a result. The thicker trench oxide has the effectof increasing the breakdown sustainability of the trench isolationstructure. The trench oxide at bottom gate electrode is sandwichedbetween the bottom gate electrode, which is electrically connected tothe source, and the N-buried layer 14 which is electrically connected tothe drain. Thus the trench oxide adjacent the bottom gate must becapable of sustaining the drain-to-source voltage of the trench LDMOStransistor.

(c) Layout Designs for Trench and Poly Gate

FIG. 3 is a top view of a dual channel trench LDMOS transistor accordingto a third embodiment of the present invention. Referring to FIG. 3, adual channel trench LDMOS transistor 200 includes a planar gate 226, N+source region 223, P+ body contact regions 242 and N+ drain region 224.A p-type body region (not shown) is located underneath the planar gate226 and the source 223. The drain drift region is formed in the N-Epilayer 216. The drain drift region may also include other N-type regionssuch as a high voltage N-well (HVNW), and/or a low voltage N-well (LVNW)(not shown in FIG. 3). In the present embodiment, a trench 230 bincluding a trench gate 228 b form an isolation structure for trenchLDMOS transistor 200. Trench 230 b encircles the active areas of trenchLDMOS transistor 200 and isolates trench LDMOS transistor 200 from otherdevices formed on the same substrate. Trench gate 228 b can be leftfloating.

In trench LDMOS transistor 200, another trench 230 houses a trench gate228 for use as an active gate in LDMOS transistor 200. The trench gate228 used for an active gate is separated from the trench gate 228 b usedfor isolation. As thus constructed, dual channel trench LDMOS transistor200 is formed having a lateral channel formed by planar gate 226 and avertical channel formed by trench gate 228.

FIG. 4 is a top view of a dual channel trench LDMOS transistor accordingto a fourth embodiment of the present invention. Trench LDMOS transistor250 of FIG. 4 is substantially the same as trench LDMOS transistor 200of FIG. 3 and like elements in both figures will not be furtherdescribed. Referring to FIG. 4, the trench LDMOS transistor 250 includestrench fingers 260 formed in the drain drift region of the transistor toform interdigitated trench and drain drift regions. The trench gate 262of the interdigitated trench fingers 260 is electrically connected tothe source potential. In this manner, a super-junction structure isformed in the drain of trench LDMOS transistor 250. The super-junctionstructure thus formed allows higher drain doping level to be used toincrease the breakdown voltage and to reduce the drain-to-sourceresistance. In the present embodiment, the sidewall oxide of theinterdigitated trench fingers 260 is thicker than the gate oxide inorder to support the source to drain voltage. It is imperative to notethat where the trench fingers 260 intersect with the planar gate 226,the planar gate 226 actually is located on top of the trench fingers260, but it is depicted the other way around in FIG. 4 to better showthe structure of the trench fingers 260.

In trench LDMOS transistor 250, a trench 230 b including a trench gate228 b form an isolation structure for trench LDMOS transistor 250. Asdescribed above, trench gate 228 b can be left floating. Furthermore,the trench oxide insulating the trench gate 228 b has a thicknessgreater than the thickness of the gate oxide layer for a trench gate sothat the isolation structure of trench 230B can withstand highervoltages.

FIG. 5 is a top view of a dual channel trench LDMOS transistor accordingto a fifth embodiment of the present invention. FIG. 6 is a top view ofa dual channel trench LDMOS transistor according to a sixth embodimentof the present invention. Trench LDMOS transistor 300 of FIG. 5 andtrench LDMOS transistor 350 of FIG. 6 are substantially the same astrench LDMOS transistor 250 of FIG. 4 and like elements in all theseveral figures will not be further described. As described above, a P+body contact region is to be provided in the trench LDMOS transistor formaking electrical contact to the body of the transistor. Referring toFIG. 5, a P+ body contact region 370 is formed in the N+ region 323 butapart from the sidewall of trench 330 and the planar gate 226. Referringto FIG. 6, the P+ body contact regions are formed as separate P+ islands390 in the N+ source region 323. The body contact region of trench LDMOStransistor can be formed in other ways suitable for making an electricalconnection to the P-body region of the LDMOS transistor.

LDMOS transistor 350 of FIG. 6 further illustrates the formation of aninterdigitated oxide-filled trench 380 with the trench gate 378extending into the interdigitated trench regions to form gateextensions. The gate extensions increase the channel width of the dualchannel LDMOS transistor.

(2) Trench Isolation in BCD process

According to another aspect of the present invention, the deepoxide-filled trenches with single or stacked gate described above,besides being used as active gates, are also used for deep trenchisolation of devices in a BCD process. In this manner, a singleoxide-filled trench structure in the BCD process is used for isolationof all devices (bipolar, CMOS, DMOS) and also as active gates for thedual channel trench LDMOS transistors.

FIG. 7 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to one embodimentof the present invention. Referring to FIG. 7, a BCD fabrication processforms an LDMOS transistor 410, an N-type metal oxide semiconductor(NMOS) transistor 450, a P-type metal oxide semiconductor (PMOS)transistor 460, and an NPN bipolar junction transistor (BJT) 470 all onP-type substrate 412 with N-buried layer 414 and N-Epi layer 416.Oxide-filled trenches 430 are formed in the semiconductor layers andextend into the P-type substrate 412 to provide device isolation. In thepresent embodiment, a single trench gate 428 is formed in trenches 430.

In the present embodiment, oxide-filled trenches 430 with the singletrench gate are formed to provide isolation between the trench LDMOStransistor 410, the MOS transistors 450, 460 and the bipolar transistor470. Because the same trench structure is to be used for all the devicesin the BCD fabrication process, the oxide-filled trenches 430 allcontain the trench gate 428 regardless of whether the trench gate isused as an active gate or not. In the case when trench 430 is used onlyfor device isolation, the trench gate 428 becomes a dummy gate and iselectrically floated or connected to other appropriate electricalpotential to deactivate the gate. By using trenches 430, transistordevices formed in the BCD processes can be individually isolated.Furthermore, trenches 430 realize a compact isolation scheme, therebyincreasing the density and reducing the cost of the BCD process.

In the present embodiment, trench gate 428 forms a vertical channel tothe N-buried layer 414 in LDMOS transistor 410. Thus, LDMOS transistor410 is a dual channel trench LDMOS transistor device with planar gate426 and vertical gate 428. In an alternate embodiment, LDMOS transistor410 may be formed as a single channel transistor device. The planar gate426 may be made the only active gate in the transistor. The trench gate428 adjacent the body region (low voltage P-well 422) of the LDMOStransistor can be inactivated by leaving it floating or connecting it toan appropriate potential to deactivate the gate.

In LDMOS transistor 410 of FIG. 7, the P-body region is formed by a lowvoltage P-well 422 and further by a high voltage P-well 421. The highvoltage P-well 421 has a lower doping concentration than the low voltageP-well 422.

In other embodiments of the present invention, the BCD processincorporates devices using P-type buried layer and the same oxide-filledtrench structure described above is used to isolate devices formed overthe P-buried layer. In yet another embodiment, the BCD processincorporates a vertical MOSFET device, such as a vertical DMOS device.The oxide-filled trench structure is used to provide the active gate forthe vertical channel of the vertical MOSFET devices.

FIG. 8 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to an alternateembodiment of the present invention. The BCD fabrication process of FIG.8 is substantially the same as the BCD fabrication process of FIG. 7 forforming an LDMOS transistor, an NMOS transistor, and a PMOS transistoras well as bipolar transistors (not shown) all on P-type substrate withN-buried layer and N-Epi layer. The BCD fabrication process of FIG. 8illustrates the use of a stacked gate structure in the oxide-filledtrenches for providing additional shielding.

(3) Drain Super-Junction Structures

According to another aspect of the present invention, super-junctionstructures are formed in the drain drift region of a dual channel trenchLDMOS transistor to reduce the drain resistance and increase thebreakdown voltage of the LDMOS transistor. In one embodiment of thepresent invention, the super-junction structure is formed usingalternating layers of N-type and P-type regions. Because the width ofthe N-type and P-type regions of the super-junction structure areselected so that they are fully depleted in operation, thesuper-junction structure can be formed using higher doping level thanthe doping level of a conventional drain drift region. The higher dopinglevel reduces the drain resistance and while the depletion of thesuper-junction structure increases the breakdown voltage of the draindrift region.

FIGS. 9 and 11 are cross-sectional view of dual channel trench LDMOStransistors with super-junction structures formed in the drain driftregion according to different embodiments of the present invention.Referring first to FIG. 9, dual channel trench LDMOS transistor 500 isconstructed in substantially the same manner as dual channel trenchLDMOS transistor 10 of FIG. 1 and like elements in both figures will notbe further described. Dual channel trench LDMOS transistor 500 includesa planar gate 526 forming a lateral channel and a trench gate 528forming a vertical channel. In the present embodiment, the planar gate526 does not extend over a field oxide layer.

Trench LDMOS transistor 500 includes alternating N-type and P-type dopedregions forming a super-junction structure in the drain drift region ofthe trench LDMOS transistor. In the present embodiment, the alternatingN-type and P-type doped regions include a first N-type region 590, asecond N-type region 594, and a P-type region 592 sandwiched between thefirst and second N-type regions, all formed in the high voltage N-well518 being the drain drift region. N-type regions 590 and 594 and P-typeregion 592 are more heavily doped than the underlying N-well 518 becausethe regions are depleted in operation. In the present embodiment, P-typeregion 592 extends into the P-body region formed by low voltage P-well522.

In one embodiment, the alternating N-type and P-type regions are formedusing multiple energy implants through a single mask. Furthermore, inanother embodiment, the alternating N-type and P-type regions are formedself-aligned to the planar gate 526. The P-type region 592 extendinginto the P-body region 522 can be realized through an angle implant andsubsequent drive-in.

As thus constructed, the alternating N-type and P-type regions in thedrain drift region have the effect of distributing the electric fieldand increasing the breakdown voltage of the LDMOS transistor. FIG. 10illustrates the electrical field distribution of the trench LDMOStransistor of FIG. 9 with and without the super-junction structure.Curve 595 illustrates the electric field distribution without thesuper-junction structure. The electric field rises in the body regionuntil the P-N junction between the body region and the N-Epi where thecritical electric field is reached. Then, the electric field decreasesalong the length of the drain drift region. Curve 597 illustrates theelectric field distribution with the super-junction structure.Electrical field is a function of the doping levels on either side ofthe P-N junction. With a higher doping level, the critical electricfield is increased. Thus, as shown in FIG. 10, curve 597 rises to a highelectric field level in the body region. Then, the super-junctionregions formed by the N-type and P-type regions 590, 592, 594, have theeffect of distributing the electric field out evenly so that theelectrical field distribution takes on a trapezoidal shape as opposed tothe triangular shape of curve 595. It is well known that the area underthe electric field is the breakdown voltage of the transistor. Bychanging the electric field distribution to the trapezoidal shape, thearea under curve 597 is much greater than the area under curve 595 andthe breakdown voltage of trench LDMOS transistor 500 with thesuper-junction structure accordingly increases.

Referring now to FIG. 11, dual channel trench LDMOS transistor 600 isconstructed in the same manner as trench LDMOS transistor 500 of FIG. 9except for the super-junction structure and like elements in bothfigures will not be further described. In trench LDMOS transistor 600,the super-junction structure is formed by a first P-type region 690, asecond P-type region 694, and an N-type region 692 sandwiched betweenthe first and second P-type regions, all formed in the high voltageN-well 618. In the present embodiment, the N-type region 692 is moreheavily doped than the P-type regions. By placing the N-type region 692between the two P-type regions 690 and 694, the P-type regions act likesuper-junction or function as RESURF regions for reducing the surfacingelectric field of the LDMOS transistor. The breakdown voltage of thetrench LDMOS transistor is thereby increased. In trench LDMOS transistor600, the alternating N-type and P-type regions are formed self-alignedto the planar gate 626. In the present embodiment, the N-type region 692does not extend outside of the high voltage N-well (HVNW) 618. In analternative embodiment, the N-type region 692 may extend outside of thehigh voltage N-well, such as by use of an angle implant instead ofself-aligning the N-type implant to the edge of the planar gate 626.

(4) Alternate Embodiments

FIG. 12 is a cross-sectional view of a dual channel trench LDMOStransistor according to an alternate embodiment of the presentinvention. Referring to FIG. 12, dual channel trench LDMOS transistor700 is formed on an N+ substrate 712 instead of a P+ substrate as in theprevious embodiments. The drain region 724 is formed on the backside ofthe N+ substrate 712, thereby forming a vertical LDMOS device. TrenchLDMOS transistor 700 includes a planar gate 726 and a vertical gate 728and N+ source region 723, all formed in a similar manner as describedabove.

FIG. 13 is a cross-sectional view of a vertical trench MOS transistoraccording to one embodiment of the present invention. Referring to FIG.13, vertical trench MOS transistor 800 is formed on an N+ substrate 812and can be integrated with a dual channel LDMOS transistor device suchas transistor 700 shown in FIG. 12. In vertical trench MOS transistor800, trench gate 828 forms the vertical gate of the MOS transistor and avertical channel is formed in the low voltage P-well (LVPW) 822. In thevertical trench MOS transistor 800, currents flow from the source region823 through the channel region in LVPW 822 into N-epitaxial layer 816,N-buried layer 814 and then to N+ substrate 812. A drain electrode 824is provided on the backside of substrate 812. A P+ body contact 818 isalso provided on the surface for good contact to the source metal 819.

FIG. 14 is a cross-sectional view of transistor devices formed using theBCD process employing deep trench isolation according to an alternateembodiment of the present invention. The transistor devices in FIG. 14are constructed in a substantially similar manner as the transistordevices in FIG. 8 and like elements in both figures will not be furtherdescribed. Referring to FIG. 14, deep trenches 930B and 930C are usedfor device isolation. Deep trenches 930B and 930C extend into the P-typesubstrate 912. In the present embodiment, deep trenches 930B and 930C donot include any trench gate structures and are purely oxide filledtrenches. In other embodiments, the deep trenches may include a singletrench gate or a stacked gate structure, as described above. Meanwhile,shallow trenches, such as trench 930A, are used to house the activegate. Shallow trench 930A extends only into the N-Epi and does notextend into the P-type substrate.

The above detailed descriptions are provided to illustrate specificembodiments of the present invention and are not intended to belimiting. Numerous modifications and variations within the scope of thepresent invention are possible. The present invention is defined by theappended claims.

I claim:
 1. A semiconductor device comprising a dual channel trenchLDMOS transistor, the dual channel trench LDMOS transistor comprising: asemiconductor layer of a first conductivity type formed on a substrate;a first trench formed in the semiconductor layer, the first trench beingfilled with a trench dielectric, a trench gate being formed in the firsttrench and insulated from the sidewall of the first trench by a firstgate dielectric layer; a body region of a second conductivity typeformed in the semiconductor layer adjacent the first trench; a sourceregion of the first conductivity type formed in the body region andadjacent the first trench; a planar gate insulated from thesemiconductor layer by a second gate dielectric layer and overlying thebody region, the source region being formed aligned to a first edge ofthe planar gate; and a drain drift region of the first conductivity typeformed in the semiconductor layer and in electrical contact with a drainelectrode, wherein the planar gate forms a lateral channel of the LDMOStransistor in the body region between the source region and the draindrift region, and the trench gate in the first trench forms a verticalchannel of the LDMOS transistor in the body region along the sidewall ofthe first trench between the source region and the semiconductor layer.2. The semiconductor device of claim 1, wherein the substrate comprisesa substrate of the second conductivity type and the LDMOS transistorfurther comprises a drain region of the first conductivity type formedin the semiconductor layer, the drain region being spaced apart from thebody region by the drain drift region, the drain region beingelectrically connected to the drain electrode.
 3. The semiconductordevice of claim 1, wherein the substrate comprises a substrate of thefirst conductivity type and the drain electrode comprises a backsidedrain electrode formed on a backside of the substrate, the dual channeltrench LDMOS transistor forming a vertical trench LDMOS transistor. 4.The semiconductor device of claim 3, further comprising a verticaltrench MOS transistor formed in a separate region of the same substrateand the same semiconductor layer, the vertical trench MOS transistorcomprising: a fourth trench formed in the semiconductor layer, thefourth trench being filled with a trench dielectric, a fourth trenchgate being formed in the fourth trench and insulated from the sidewallof the fourth trench by a fourth gate dielectric layer; a fourth bodyregion of the second conductivity type formed in the semiconductor layeradjacent the fourth trench, the fourth body region extending to a depthnear a bottom edge of the fourth trench gate formed in the fourthtrench; and a source region of the first conductivity type formed in thefourth body region and adjacent the fourth trench, the source regionbeing formed in a top portion of the fourth body region, wherein thevertical trench MOS transistor is formed with the substrate being adrain region, the semiconductor layer being a drain drift region, andthe fourth trench gate being a gate electrode of the vertical trench MOStransistor.
 5. The semiconductor device of claim 1, the trench gate andplanar gate are electrically connected to a gate control signal to beturned on and off in unison.
 6. The semiconductor device of claim 1, thetrench gate is electrically connected to a trench gate control signaland the planar gate is electrically connected to a planar gate controlsignal so that the trench gate and the planar gate are to be turned onand off independently of each other.
 7. The semiconductor device ofclaim 1, wherein the first trench extends through the semiconductorlayer into the substrate, the trench gate being formed in an upperportion of the first trench.
 8. The semiconductor device of claim 2,wherein the first trench extends through the semiconductor layer intothe substrate, the trench gate being formed in an upper portion of thefirst trench and the semiconductor device further comprises: a bottomgate electrode being formed in a lower portion of the first trench andinsulated from the sidewall of the first trench by the trench dielectrichaving a second thickness, the second thickness being greater than thethickness of the first gate dielectric layer insulating the trench gate,the bottom gate electrode being electrically connected to a sourcepotential.
 9. The semiconductor device of claim 2, wherein the firsttrench extends only into the semiconductor layer and the semiconductordevice further comprises: a second trench formed in the semiconductorlayer and extending into the substrate, the second trench being filledwith the trench dielectric, wherein the second trench encircles activeareas of the LDMOS transistor to provide electrical isolation of theLDMOS transistor.
 10. The semiconductor device of claim 9, furthercomprising a MOS or bipolar transistor formed in the semiconductor layeradjacent to the second trench, the MOS or bipolar transistor beingelectrically isolated from the LDMOS transistor by the second trench.11. The semiconductor device of claim 2, wherein the first trenchextends through the semiconductor layer into the substrate, the trenchgate being formed in an upper portion of the first trench, thesemiconductor device further comprising: a second trench formed in thesemiconductor layer and extending into the substrate, the second trenchbeing filled with the trench dielectric, a trench gate being formed inan upper portion of the second trench and insulated from the sidewall ofthe second trench by a third gate dielectric layer, the trench gatebeing electrically floating or electrically connected to a givenpotential for deactivating the trench gate in the second trench, whereinthe second trench encircles active areas of the LDMOS transistor toprovide electrical isolation of the LDMOS transistor.
 12. Thesemiconductor device of claim 11, wherein the third gate dielectriclayer has a thickness greater than the thickness of the first gatedielectric layer.
 13. The semiconductor device of claim 11, furthercomprising a MOS or bipolar transistor formed in the semiconductor layeradjacent to the second trench, the MOS or bipolar transistor beingelectrically isolated from the LDMOS transistor by the second trench.14. The semiconductor device of claim 8, further comprising: a secondtrench formed in the semiconductor layer and extending into thesubstrate, the second trench being filled with a trench dielectric, atrench gate being formed in an upper portion of the second trench andinsulated from the sidewall of the second trench by a third gatedielectric layer, and a bottom gate electrode being formed in a lowerportion of the second trench and insulated from the sidewall of thesecond trench by the trench dielectric, the trench dielectric having athickness greater than the third gate dielectric layer, the trench gatebeing electrically floating or electrically connected to a givenpotential for deactivating the trench gate in the second trench, and thebottom gate electrode being electrically connected to a sourcepotential, wherein the second trench encircles active areas of the LDMOStransistor to provide electrical isolation of the LDMOS transistor. 15.The semiconductor device of claim 14, wherein the third gate dielectriclayer has a thickness greater than the thickness of the first gatedielectric layer.
 16. The semiconductor device of claim 14, furthercomprising a MOS or bipolar transistor formed in the semiconductor layeradjacent to the second trench, the MOS or bipolar transistor beingelectrically isolated from the LDMOS transistor by the second trench.17. The semiconductor device of claim 1, wherein the semiconductor layercomprises an epitaxial layer of the first conductivity type and thesemiconductor layer further comprises a buried layer of the firstconductivity type formed on the substrate, the epitaxial layer beingformed on the buried layer.
 18. The semiconductor device of claim 1,wherein the first conductivity type is P-type and the secondconductivity type is N-type.
 19. The semiconductor device of claim 1,wherein the first conductivity type is N-type and the secondconductivity type is P-type.
 20. A method for forming a semiconductordevice comprising a dual channel trench LDMOS comprising: forming asemiconductor layer of a first conductivity type on a substrate; forminga first trench in the semiconductor layer, the first trench being filledwith a trench dielectric; forming a trench gate in the first trench, thetrench gate being insulated from the sidewall of the first trench by afirst gate dielectric layer; forming a body region of the secondconductivity type in the semiconductor layer adjacent the first trench;forming a source region of the first conductivity type in the bodyregion and adjacent the first trench; forming a planar gate insulatedfrom the semiconductor layer by a second gate dielectric layer andoverlying the body region, the source region being formed aligned to afirst edge of the planar gate; and forming a drain drift region of thefirst conductivity type in the semiconductor layer and in electricalcontact with a drain electrode, wherein the planar gate forms a lateralchannel of the LDMOS transistor in the body region between the sourceregion and the drain drift region, and the trench gate in the firsttrench forms a vertical channel of the LDMOS transistor in the bodyregion along the sidewall of the first trench between the source regionand the semiconductor layer.
 21. The method of claim 20, furthercomprising: providing a substrate of the second conductivity type as thesubstrate; and forming a drain region of the first conductivity type inthe semiconductor layer, the drain region being spaced apart from thebody region by a drain drift region, the drain region being electricallyconnected to the drain electrode.
 22. The method of claim 20, furthercomprising: providing a substrate of the first conductivity type as thesubstrate; and forming a backside drain electrode on a backside of thesubstrate as the drain electrode, the dual channel trench LDMOStransistor forming a vertical trench LDMOS transistor.
 23. The method ofclaim 20, further comprising: forming a second trench in thesemiconductor layer and extending into the substrate, the second trenchbeing filled with the trench dielectric, the second trench encirclingactive areas of the LDMOS transistor to provide electrical isolation ofthe LDMOS transistor.
 24. The method of claim 23, further comprising:forming a MOS or bipolar transistor in the semiconductor layer adjacentto the second trench, the MOS or bipolar transistor being electricallyisolated from the LDMOS transistor by the second trench.